A polyamide resin composition of the present invention comprises: a first polyamide resin including 60 to 90 mol% of a repeating unit represented by chemical formula 1 of the specification and 10 to 40 mol% of a repeating unit represented by chemical formula 2 of the specification; a second polyamide resin including a repeating unit represented by chemical formula 3 of the specification; and an inorganic filler. The polyamide resin composition has excellent heat resistance, rigidity, hydrolysis resistance, moisture absorption resistance, processability, physical property balance thereof, and the like. Further, the polyamide resin composition can be used at a high temperature condition of 130C or higher for a long time.

    본 발명의 폴리아미드 수지 조성물은 명세서의 화학식 1로 표시되는 반복단위 60 내지 90 몰% 및 명세서의 화학식 2로 표시되는 반복단위 10 내지 40 몰%를 포함하는 제1 폴리아미드 수지; 명세서의 화학식 3으로 표시되는 반복단위를 포함하는 제2 폴리아미드 수지; 및 무기 필러;를 포함하는 것을 특징으로 한다. 상기 폴리아미드 수지 조성물은 내열성, 강성, 내가수분해성, 내흡습성, 가공성, 이들의 물성 발란스 등이 우수하고, 130℃ 이상의 고온 조건에서 장기간 사용이 가능하다.


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    Title :

    POLYAMIDE RESIN COMPOSITION AND ARTICLE COMPRISING THE SAME


    Additional title:

    폴리아미드 수지 조성물 및 이를 포함하는 성형품


    Contributors:
    SHIN CHAN GYUN (author) / KIM KYUNG RAE (author) / KIM IK MO (author) / HONG SANG HYUN (author)

    Publication date :

    2017-08-31


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Korean


    Classification :

    IPC:    C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / B62D MOTOR VEHICLES , Motorfahrzeuge / C08J Verarbeitung , WORKING-UP / C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS



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