본 발명은 유연 열전모듈에 관한 발명이다. 본 발명의 실시예에 따른 유연 열전모듈은, 제1 열전시트, 상기 제1 열전시트 상에 적층된 제1 유연기판, 상기 제1 유연기판 상에 적층된 유연 열전소자, 상기 유연 열전소자 상에 적층된 제2 유연기판, 상기 제2 유연기판 상에 적층된 제2 열전시트 및 상기 제1 열전시트에 연결된 열방출기구를 포함할 수 있다.
The present invention relates to a flexible thermoelectric module. The flexible thermoelectric module according to an embodiment of the present invention includes a first thermoelectric sheet, a first flexible substrate laminated on the first thermoelectric sheet, a flexible thermoelectric element stacked on the first flexible substrate, a second flexible substrate stacked on the flexible thermoelectric element, a second thermoelectric sheet stacked on the second flexible substrate, and a heat discharge mechanism connected to the first thermoelectric sheet. Accordingly, the present invention can provide optimum thermoelectric performance.
FLEXIBLE THERMOELECTRIC MODULE
유연 열전모듈
2024-12-17
Patent
Electronic Resource
Korean
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