A next-generation ship rack-type electronic facility including the cooling assembly according to the present invention, in the next-generation ship rack-type electronic facility including a housing in which an accommodation space for accommodating electronic components is formed and a cooling assembly for cooling electronic devices provided in the electronic components, includes a cooling assembly including: a heat absorbing unit for the device that is in surface contact on the electronic device to absorb heat generated from the electronic device; a heat conduction unit having one side connected to the heat absorbing unit for device to transfer heat absorbed by the heat absorbing unit for device from one side to the other; and a heat exchange unit connected to the other side of the heat conduction unit to dissipate the heat transferred from the heat conduction unit; and a discharge fan provided in a housing so as to be adjacent to the heat exchange unit to discharge heat emitted from the heat exchange unit to the outside of the housing, therefore, an air cooling system provided in a plurality of electronic devices is simplified to minimize the volume and weight of the entire system.
본 발명에 따른 냉각 어셈블리를 포함하는 차세대 함정용 랙형 전자장비는, 내부에 전자부품이 수용되는 수용공간이 형성된 하우징 및 상기 전자부품에 구비되는 전자소자의 냉각을 위한 냉각 어셈블리를 포함하는 차세대 함정용 랙형 전자장비에 있어서, 상기 냉각 어셈블리는, 상기 전자소자 상에 면접촉되어 상기 전자소자에서 발생하는 열을 흡수하는 소자용 흡열유닛, 일측이 상기 소자용 흡열유닛에 연결되어 상기 소자용 흡열유닛이 흡수한 열을 일측으로부터 타측으로 전달시키는 열전도유닛, 상기 열전도유닛의 타측에 연결되어, 상기 열전도유닛으로부터 전달된 열을 발산시키는 열교환유닛 및 상기 열교환유닛에 인접하도록 상기 하우징에 구비되어 상기 열교환유닛으로부터 발산되는 열을 상기 하우징 외측으로 배출시키는 배출팬을 포함한다.
Rack Type Electronic Equipment for Next Generation Warship Having Cooling Assembly
냉각 어셈블리를 포함하는 차세대 함정용 랙형 전자장비
2020-07-02
Patent
Electronic Resource
Korean
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