To provide an electronic device including a structure for heat dissipation.SOLUTION: An electronic device according to one embodiment includes a first housing including an internal space, a second housing coupled to the first housing so as to be inclined relative to the first housing, a printed circuit board disposed in the internal space, a slit extending into the internal space, and a central processing unit disposed on the printed circuit board and facing the slit. The electronic device may include a heat sink disposed on the central processing unit and having at least a portion protruding to the outside through the slit in order to transfer heat emitted from the central processing unit to the outside of the electronic device.SELECTED DRAWING: None

    【課題】放熱のための構造を含む電子装置を提供する。【解決手段】一実施形態によれば、電子装置は、内部空間を含む第1のハウジングと、第1のハウジングに対して傾斜するように、第1のハウジングと結合される第2のハウジングと、内部空間に配置されたプリント回路基板と、内部空間に延びるスリットと、プリント回路基板上に配置され、スリットに向かう中央処理装置とを含むことができる。この電子装置は、中央処理装置から放出された熱を、電子装置の外部に伝達するために、中央処理装置上に配置され、スリットを介して少なくとも一部が外部に突出した放熱板を含むことができる。【選択図】なし


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    Title :

    ELECTRONIC DEVICE INCLUDING STRUCTURE FOR HEAT DISSIPATION


    Additional title:

    放熱のための構造を含む電子装置


    Contributors:
    LEE YONG (author)

    Publication date :

    2024-10-16


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / G06F ELECTRIC DIGITAL DATA PROCESSING , Elektrische digitale Datenverarbeitung



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