To provide a microphone assembly that can fully demonstrate its performance as a microphone even when placed on the back surface of a head lining skin or base material.SOLUTION: A microphone assembly includes a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and a hot melt formed to cover the circuit board, the microphone element, and the external connection interface and perforated to expose a portion of the back surface of the circuit board or the sound receiving portion of the microphone element.SELECTED DRAWING: Figure 1

    【課題】ヘッドライニング表皮や基材の裏面に配置しても、マイクロホンとしての性能を十分に発揮することができるマイクロホンアセンブリを提供する。【解決手段】回路基板と、回路基板に接続されたマイクロホン素子と、回路基板に接続された外部接続インターフェースと、回路基板と、マイクロホン素子と、外部接続インターフェースを覆うように形成され、回路基板の裏面の一部、または前記マイクロホン素子の受音部が露出するように孔が設けられたホットメルトを含む。【選択図】図1


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    Title :

    MICROPHONE ASSEMBLY, HEAD LINING ASSEMBLY


    Additional title:

    マイクロホンアセンブリ、ヘッドライニングアセンブリ


    Contributors:

    Publication date :

    2022-10-17


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    H04R LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS , Lautsprecher, Mikrofone, Schallplatten-Tonabnehmer oder ähnliche akustische, elektromechanische Wandler / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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