To provide a novel sealant composition that overcomes the shortcomings of the conventional art: insufficient sealability of a through-hole to be formed when a foreign material such as a nail sticks into a tread; insufficient viscosity temperature dependence of the sealant composition; and insufficient flowability of the sealant composition during storage of the tire.SOLUTION: The present invention discloses a sealant composition constituting a sealant layer, the sealant layer provided on the inner surface of a pneumatic tire. The sealant composition comprises (A) a rubber component, (B) a tackifying agent, and (C) a plasticizing agent. The softening point of (B) the tackifying agent is 50°C or more. The kinematic viscosity of (C) the plasticizing agent at 40°C is 2,500 mm2/s or less. The mass ratio (C)/(B) of (C) the plasticizing agent to (B) the tackifying agent is 0.35 or more.SELECTED DRAWING: None

    【課題】従来技術では、釘等の異物がトレッド部に突き刺さった際に形成された貫通孔に対するシール性、シーラント材組成物の粘度温度依存性、タイヤ保管時のシーラント材組成物の流れ性に課題があり、その解決が求められている。【解決手段】タイヤ内表面にシーラント層を備えた空気入りタイヤの前記シーラント層を構成するシーラント材組成物であって、(A)ゴム成分、(B)粘着付与剤、および(C)可塑剤を含み、前記(B)粘着付与剤の軟化点が50℃以上であり、前記(C)可塑剤の40℃での動粘度が2500mm2/s以下であり、前記(B)粘着付与剤と前記可塑剤(C)の質量比が、前記(C)/(B)として0.35以上であるシーラント材組成物によって上記課題を解決した。【選択図】なし


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    Title :

    SEALANT COMPOSITION AND TIRE USING THE SAME


    Additional title:

    シーラント材組成物およびそれを用いたタイヤ


    Contributors:

    Publication date :

    2022-08-05


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60C VEHICLE TYRES , Fahrzeugreifen / C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS / C09K Materialien für Anwendungen, soweit nicht anderweitig vorgesehen , MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR



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