To provide a resin molding having a high bond strength of a resin member to a base material and high rigidity of the base material even when a pressurization force in molding press is low.SOLUTION: A method for manufacturing a resin molding 10 obtained by joining a resin member 15 to a base material 11 containing a fiber and a thermosetting resin includes a plate-like body formation step of forming a plate-like body 12 having a film 14 of a thermosetting resin provided on a mat 13 composed of fibers and a resin molding formation step of joining the resin member 15 to the plate-like body 12, in which the resin molding formation step executes in order a first press step of pressing the plate-like body 12 with a pair of molds 21 and 25 so that its thickness becomes a thickness T2 smaller than a predetermined thickness T3 before the thermosetting resin is cured, and a second press step of displacing the one mold 21 in a mold-opening direction so as to press the plate-like body 12 with the predetermined thickness T3, and pressing the plate-like body while heating the thermosetting resin until it is cured.SELECTED DRAWING: Figure 5

    【課題】成形プレス時の加圧力が低い場合でも、基材に対する樹脂部材の接合強度および基材の剛性が高い樹脂成形体を提供する。【解決手段】繊維および熱硬化性樹脂を含む基材11に樹脂部材15が接合された樹脂成形体10の製造方法であって、繊維からなるマット13に熱硬化性樹脂の被膜14を設けた板状体12を形成する板状体形成工程と、板状体12に対し樹脂部材15を接合する樹脂成形体形成工程と、を含み、樹脂成形体形成工程において、板状体12を所定の厚みT3よりも小さい厚みT2となるように熱硬化性樹脂が硬化する前に一対の型21,25によりプレスする第1プレス工程と、板状体12を所定の厚みT3でプレスすべく一方の型21を型開き方向に変位させ、熱硬化性樹脂が硬化するまで加熱しつつプレスする第2プレス工程と、を順に実行する。【選択図】図5


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    Title :

    METHOD FOR MANUFACTURING RESIN MOLDING


    Additional title:

    樹脂成形体の製造方法


    Contributors:

    Publication date :

    2021-01-28


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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