To improve vibration resistance in a water-proof type substrate housing enclosure for pressure holding a circuit board by using a pair of case and elastic member.SOLUTION: A metal first case 110A and a resin second case 120A hold a circuit board 130 airtightly by means of an adhesive seal material 140b, and at the tip of a plurality of pressing elastic parts 121x provided at the outer boundary of the second case 120A, engaging elastic members 121a having a nail 124 are stood with an angle of tilt θ of less than 90 degrees. When a first case 110A is mounted by means of an assembly jig, the engaging elastic member 121a retreats, and when the first case 110A is pushed in, the pressing elastic part 121x is bent upward by a jig pedestal base 192, and the nail 124 engages. When the jig is removed, the first and second cases are brought into pressure contact by the restitutive force of the pressing elastic part 121x. When the adhesive seal material 140b is dry-cured, close adhesion between the cases is secured by the adhesive strength thereof.SELECTED DRAWING: Figure 4

    【課題】一対のケースと弾性部材を用いて回路基板を圧接挟持する防水型基板収納筐体における耐振性を向上する。【解決手段】金属製の第1ケース110Aと樹脂製の第2ケース120Aは接着シール材140bによって回路基板130を密閉挟持し、第2ケース120Aの外周に設けられた複数の押圧弾性部121xの先端には、爪状部124を有する係合弾性部材121aが90度未満の傾斜角θで立設され、組立治具により第1ケース110Aを搭載すると係合弾性部材121aが後退し、更に第1ケース110Aを押し込むと、治具台座192によって押圧弾性部121xが上方に湾曲して、爪状部124が係合し、治具を外すと押圧弾性部121xの復元力によって第1ケースと第2ケースが圧接される。接着シール材140bが乾燥硬化すると、その接着力によってケース間の密着一体性が確保される。【選択図】図4


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    Title :

    WATER-PROOF TYPE SUBSTRATE HOUSING ENCLOSURE


    Additional title:

    防水型基板収納筐体


    Contributors:

    Publication date :

    2019-11-21


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Japanese


    Classification :

    IPC:    F16J Kolben , PISTONS / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS



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