To improve heat dissipation of a circuit unit.SOLUTION: A circuit unit includes: a circuit body 11 having a resin part 12 covering a circuit, a first terminal part 15 protruding from one edge part of the resin part 12, and a second terminal part 16 protruding from the other edge part of the resin part 12; a metallic fixing member 20 which is mounted on a base member in a state abutted on the resin part 12 and fixes the circuit body 11 to the base member; and a cover 30 which has a plurality of hood parts 35, 36 fitted to a plurality of mating connectors 50A, 50B while covering the first terminal part 15 and the second terminal part 16 and covers the circuit body 11 and the fixing member 20. In the cover 30, an opening 33 exposing the fixing member 20 to the outside is formed.SELECTED DRAWING: Figure 6
【課題】回路ユニットの放熱性を向上させる。【解決手段】回路ユニットは、回路を覆う樹脂部12と樹脂部12の一方の縁部から突出する第1端子部15と樹脂部12の他方の縁部から突出する第2端子部16とを有する回路体11と、樹脂部12に当接した状態でベース部材に取り付けられ、回路体11をベース部材に固定する金属製の固定部材20と、第1端子部15と第2端子部16とを覆って複数の相手側コネクタ50A、50Bと嵌合する複数のフード部35、36を有し、回路体11及び固定部材20を覆うカバー30と、を備える。カバー30には、固定部材20を外部に露出させる開口部33が形成されている。【選択図】図6
CIRCUIT UNIT
回路ユニット
2019-01-10
Patent
Electronic Resource
Japanese
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H02G INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES , Verlegen oder Installieren elektrischer Kabel oder Leitungen, Verlegen oder Installieren kombinierter optischer und elektrischer Kabel oder Leitungen |
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