PROBLEM TO BE SOLVED: To provide a cooling device capable of facilitating suppression of a housing of a non-contact power supply device installed on a non-contact power supply system from being enlarged.SOLUTION: A cooling device 20 (a cooling device for non-contact power supply) includes a flow channel body 30 which is positioned outside a housing 10 of a power supply device 3 (a non-contact power supply device) installed on a non-contact power supply system 1 and is connected with the housing 10 and to which heat is transferred from the housing 10, as one example. A flow channel 31c in which fluid runs is formed inside the flow channel body 30.SELECTED DRAWING: Figure 5
【課題】非接触給電システムに設けられる非接触給電装置の筐体の大型化を抑制しやすい冷却装置を得る。【解決手段】冷却装置20(非接触給電用冷却装置)は、例えば、非接触給電システム1に設けられた受電装置3(非接触給電装置)の筐体10の外側に位置され、筐体10に接続され筐体10から熱が伝えられる流路体30を備えている。流路体30の内部には、流体が流れる流路31cが設けられている。【選択図】図5
COOLING DEVICE FOR NON-CONTACT POWER SUPPLY
非接触給電用冷却装置
2018-06-14
Patent
Electronic Resource
Japanese
IPC: | H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER , Schaltungsanordnungen oder Systeme für die Abgabe oder Verteilung elektrischer Leistung / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES |
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