PROBLEM TO BE SOLVED: To provide a microphone comprising a sealing structure for a lower sound hole type mounted microphone sensor to be mounted on a printed circuit board.SOLUTION: The present invention relates to a microphone comprising: a printed circuit board 41 including a first sound hole 46; a microphone element 43 mounted on the printed circuit board 41 so as to cover the first sound hole 46; a microphone housing which includes a second sound hole 51 and in which the printed circuit board 41 is accommodated in such a manner that the second sound hole 51 faces the first sound hole 46; and a bush 30 including a third sound hole 31 disposed between the second sound hole 51 and the first sound hole 46 and communicates with the first sound hole 46 and the second sound hole 51, a first abutment surface 32 abutted with a lower surface of the printed circuit board 41 at one end side of the third sound hole 31, and a second abutment surface 33 abutted with an inner surface of the microphone housing at the other end side of the third sound hole 31.SELECTED DRAWING: Figure 1
【課題】プリント基板に実装される下音孔型の実装マイクセンサーに対するシーリング構造を備えたマイクロフォンを提供すること。【解決手段】第1の音孔46を有するプリント基板41と、前記第1の音孔46を覆うように前記プリント基板41上に実装されたマイクロフォン素子43と、第2の音孔51を有し、前記第2の音孔51と前記第1の音孔46とが対向するように前記プリント基板41を収納するマイクロフォン筐体と、前記第2の音孔51と前記第1の音孔46の間に配設されて、前記第1の音孔46及び前記第2の音孔51と連通する第3の音孔31と、前記第3の音孔31の一端側で前記プリント基板41の下面と当接する第1の当接面32と、前記第3の音孔31の他端側で前記マイクロフォン筐体の内面と当接する第2の当接面33と、を有するブッシュ30と、を備えるマイクロフォン。【選択図】図1
MICROPHONE
マイクロフォン
2017-10-05
Patent
Electronic Resource
Japanese
IPC: | H04R LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS , Lautsprecher, Mikrofone, Schallplatten-Tonabnehmer oder ähnliche akustische, elektromechanische Wandler / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR |