PROBLEM TO BE SOLVED: To provide an electric connection box and a wiring harness capable of suppressing heat generated at a semiconductor relay from being propagated to a control circuit.SOLUTION: An electric connection box comprises: a conductive input bus bar 20; a conductive output bus bar 30 that can be electrically connected with the input bus bar 20; a semiconductor relay 40 electrically connected with the input bus bar 20 and the output bus bar 30, and that switches an energization state and a cut-off state of the input bus bar 20 and the output bus bar 30; a substrate 60 on which a control circuit that outputs a control signal for controlling the semiconductor relay 40 is mounted; and a control terminal 61 for electrically connecting between the control circuit and the semiconductor relay 40, and that outputs the control signal to the semiconductor relay 40. The semiconductor relay 40 is attached to at least any one of the input bus bar 20 and the output bus bar 30. The input bus bar 20, the output bus bar 30, and the semiconductor relay 40 are arranged so as to be separated from the substrate 60.SELECTED DRAWING: Figure 3
【課題】半導体リレーで生じた熱が制御回路に伝導することを抑制する電気接続箱およびワイヤハーネスを提供する。【解決手段】導電性の入力用バスバ20と、入力用バスバ20と電気的に接続可能な導電性の出力用バスバ30と、入力用バスバ20および出力用バスバ30と電気的に接続され、入力用バスバ20および出力用バスバ30の通電状態と遮断状態とを切り替える半導体リレー40と、半導体リレー40を制御する制御信号を出力する制御回路が実装された基板60と、制御回路と半導体リレー40とを電気的に接続し、制御信号を半導体リレー40へ出力する制御端子61と、を備え、半導体リレー40は、入力用バスバ20および出力用バスバ30の少なくともいずれか一方に取り付けられ、入力用バスバ20と出力用バスバ30と半導体リレー40とは、基板60から離間して配置されている。【選択図】図3
ELECTRIC CONNECTION BOX AND WIRING HARNESS
電気接続箱およびワイヤハーネス
2017-08-24
Patent
Electronic Resource
Japanese
IPC: | H02G INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES , Verlegen oder Installieren elektrischer Kabel oder Leitungen, Verlegen oder Installieren kombinierter optischer und elektrischer Kabel oder Leitungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES |
ELECTRIC CONNECTION STRUCTURE, ELECTRIC CONNECTION BOX, AND WIRING HARNESS
European Patent Office | 2020
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