PROBLEM TO BE SOLVED: To improve sealing performance at an overlapping part of waterproof seal materials in a frame hermetically housing a circuit board by using a base, a cover, and a connector housing.SOLUTION: A cover 400A comprises: a third seal concave surface part 403A that forms a third seal gap together with a base (200A); a first seal concave surface part 431A provided on a trapezoidal hypotenuse part 413a on the cover side of first seal gaps between the first seal concave surface part and three trapezoidal sides of a connector housing (330A) whose end surface has a trapezoidal shape; and a supplement slope part 419 which is a part of the trapezoidal hypotenuse part 413a. When a waterproof seal material (501) is applied on a first seal gap surface and, after that, the connector housing is installed, thinning caused by a scrape of the waterproof seal material is supplemented with a supplement end part (501z) of the waterproof seal material applied on the supplement slope part 419. Thereby, sealing performance is improved, no auxiliary seal groove is required, and mold structures for the connector housing and the cover are simplified.SELECTED DRAWING: Figure 8
【課題】ベースとカバーとコネクタハウジングとによって回路基板を密閉収納する筐体において、防水シール材の重合部におけるシール性能を改善する。【解決手段】カバー400Aは、ベース(200A)との間で第三シール間隙を構成する第三シール凹面部403Aと、端面が台形形状であるコネクタハウジング(330A)の台形三辺との間における第一シール間隙の内、カバー側の台形斜辺部413aに設けられた第一シール凹面部431Aと、台形斜辺部413aの一部である補充斜面部419とを備え、第一シール間隙面に防水シール材(501)を塗布してから、コネクタハウジングが設置されたときに、防水シール材が掻き取られて希薄になるのを補充斜面部419に塗布された防水シール材の補充端部(501z)によって補充する。これによりシール性能が向上し、補助シール溝を必要とせず、コネクタハウジング及びカバーの金型構造が簡単となる。【選択図】図8
WATERPROOF CONTROL UNIT AND ASSEMBLY METHOD THEREFOR
防水型制御ユニットとその組立方法
2017-04-20
Patent
Electronic Resource
Japanese
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