An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the data line layer and the ground layer and between the ground layer and the power line layer, respectively, wherein the ground layer comprises a common ground and a chassis ground electrically insulated from the common ground.


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    Title :

    PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING SAME


    Additional title:

    LEITERPLATTE UND GEHÄUSE EINER ELEKTRONISCHEN KOMPONENTE DAMIT
    CARTE DE CIRCUIT IMPRIMÉ ET BOÎTIER DE COMPOSANT ÉLECTRONIQUE LA COMPRENANT


    Contributors:

    Publication date :

    2020-01-15


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES




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