An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the data line layer and the ground layer and between the ground layer and the power line layer, respectively, wherein the ground layer comprises a common ground and a chassis ground electrically insulated from the common ground.
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING SAME
LEITERPLATTE UND GEHÄUSE EINER ELEKTRONISCHEN KOMPONENTE DAMIT
CARTE DE CIRCUIT IMPRIMÉ ET BOÎTIER DE COMPOSANT ÉLECTRONIQUE LA COMPRENANT
2020-01-15
Patent
Electronic Resource
English
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