Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.


    Access

    Download


    Export, share and cite



    Title :

    POWER MODULE AND PRODUCTION METHOD FOR POWER MODULE


    Additional title:

    LEISTUNGSMODUL UND HERSTELLUNGSVERFAHREN FÜR LEISTUNGSMODUL
    MODULE DE PUISSANCE ET PROCÉDÉ DE PRODUCTION POUR MODULE DE PUISSANCE


    Contributors:

    Publication date :

    2016-11-23


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



    Base module of hybrid power module, P2 hybrid power module and P1 hybrid power module

    WANG HUAN / SHANG MINGLI / JIN ZHITAO | European Patent Office | 2021

    Free access

    Power module

    SHIMAZU HIROMI / NAKATSU KINYA / SASAKI KOUJI et al. | European Patent Office | 2018

    Free access

    POWER MODULE

    IDE EIICHI / NISHIOKA EIJI / ISHII TOSHIAKI et al. | European Patent Office | 2019

    Free access

    Power module

    NICOLAU SEBASTIAN / WALLER GILLES | European Patent Office | 2022

    Free access

    Power Module

    SHIMAZU HIROMI / NAKATSU KINYA / SASAKI KOUJI et al. | European Patent Office | 2017

    Free access