The invention relates to the technical field of aerospace composite materials, in particular to a light electromagnetic compatibility high-heat-dissipation composite material case. The embodiment of the invention provides a light electromagnetic compatibility high-heat dissipation composite material case which comprises a case body composed of a plate body, the plate body is of a skin foam sandwich structure and comprises skins on the two sides and a foam sandwich in the middle, and solid blocks are pre-embedded in preset hole positions of the foam sandwich. The solid blocks are used for machining connecting holes so that different plate bodies can be connected in a matched mode through the connecting columns and the connecting holes. The skin is made of conductive materials, the case body comprises an equipment bin and a heat dissipation bin, the equipment bin and the heat dissipation bin are communicated through a heat dissipation channel, electronic equipment is installed in the equipment bin, the heat dissipation bin is provided with heat dissipation fins, the heat dissipation fins are connected with the electronic equipment through the heat dissipation channel, and the heat dissipation bin is provided with heat dissipation openings communicated with the outside. The embodiment of the invention provides a light electromagnetic compatibility high-heat dissipation composite material case which has the excellent performance of light weight, electromagnetic compatibility and high heat dissipation.

    本发明涉及航空航天复合材料技术领域,特别涉及一种轻质电磁兼容高散热的复合材料机箱。本发明实施例提供了一种轻质电磁兼容高散热的复合材料机箱,包括由板体构成的机箱主体,板体为蒙皮泡沫夹心结构,包括两侧的蒙皮和中间的泡沫夹心,泡沫夹心在预设孔位处预埋有实心块,实心块用于加工连接孔以便不同板体通过连接柱和连接孔配合连接;蒙皮采用导电材料制备,机箱主体包括设备仓和散热仓,设备仓和散热仓通过散热通道连通,设备仓内安装有电子设备,散热仓设置有散热片,散热片经由散热通道和电子设备连接,散热仓设置有与外界连通的散热口。本发明实施例提供了一种轻质电磁兼容高散热的复合材料机箱,具有轻质、电磁兼容和高散热的优异性能。


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    Title :

    Light electromagnetic-compatibility high-heat-dissipation composite material case


    Additional title:

    一种轻质电磁兼容高散热的复合材料机箱


    Contributors:
    LI ZHUODA (author) / WANG KAI (author) / JING WENQI (author) / CAO PENGYU (author) / SU PENGLEI (author) / LUO LING (author)

    Publication date :

    2025-01-21


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT




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