The embodiment of the invention relates to the technical field of automobiles, and particularly provides a PCBA assembly and a vehicle, and the PCBA assembly comprises a chip assembly which is arranged on a PCBA and comprises at least one chip; a mounting space is formed in the mounting part, and the PCBA and the chip assembly are accommodated in the mounting space; wherein the mounting part comprises a heat dissipation assembly, and an electric path can be formed in the heat dissipation assembly and/or between the heat dissipation assembly and other parts of the mounting part. By means of the structure, the risk that the PCBA generates radiation through the heat dissipation assembly can be effectively reduced. The formation of the electrical path should be understood as a condition that the electrical path can be formed, for example, the conductive structures in the mounting part are connected with one another through one or more conductive structures.

    本申请实施例涉及汽车技术领域,具体提供了一种PCBA组件、车辆,其中的PCBA组件包括:芯片组件,其设置于PCBA,所述芯片组件包括至少一个芯片;以及安装部,其形成有安装空间,所述PCBA和所述芯片组件容纳于所述安装空间内;其中,所述安装部包括散热组件,所述散热组件的内部和/或所述散热组件与所述安装部的其他部分之间能够形成电通路。通过这样的构成,能够谋求有效地降低PCBA通过散热组件产生辐射的风险。此处所说的能够形成电通路应当理解为具有能够形成电通路的条件,如通过一个或者多个能够导电的结构将安装部中能够导电的结构之间彼此连接。


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    Title :

    PCBA assembly and vehicle


    Additional title:

    PCBA组件、车辆


    Contributors:
    LIU SHUAIJIE (author) / XU YUHUA (author) / SHI JIEPEI (author) / ZHOU WEI (author)

    Publication date :

    2025-01-21


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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