The invention relates to a semiconductor vehicle-mounted cold and warm box with an efficient heat exchange structure. The semiconductor cooling and heating box solves the technical problems that an existing semiconductor cooling and heating box in a single direct cooling or air cooling heat exchange mode cannot achieve rapid heating and cooling of loads in the box and the like. Comprising a cold-warm box inner shell with a containing cavity, the lower end of the cold-warm box inner shell is sealed through a cold-end heat preservation layer, a circulation cavity is formed in the lower end of the cold-warm box inner shell, the circulation cavity is communicated with the containing cavity through an air cooling circulation structure, cold-end fins are arranged at the lower end of the cold-warm box inner shell, and the upper ends of the cold-end fins are provided with containing faces. The lower ends of the cold-end fins are connected with the thermoelectric refrigeration assembly through the cold conduction block. The direct cooling and air cooling combined heat exchanger has the advantages that a direct cooling and air cooling combined heat exchange mode is adopted during working, meanwhile, the contact area of a load and a direct cooling area is increased, the heat exchange capacity of the load can be further improved through an air cooling circulation structure, and the load placed in the heat exchanger can be heated and cooled more quickly.
本发明涉及一种具有高效热交换结构的半导体车载冷暖箱。它解决了现有单一的直冷或者风冷换热形式的半导体冷暖箱对于箱内负载无法实现快速的升温、降温等技术问题。包括具有放置腔的冷暖箱内壳,冷暖箱内壳下端通过冷端保温层封闭,冷暖箱内壳下端设有循环腔,循环腔通过风冷循环结构与放置腔相连通,在冷暖箱内壳下端设有冷端翅片,冷端翅片上端具有放置面,冷端翅片下端通过导冷块热电制冷组件相连。优点在于:在工作时采用直冷与风冷相结合的换热方式,同时提升负载与直冷区域的接触面积,风冷循环结构还可进一步提升负载热交换能力,使放入内部的负载实现更快速的升温与降温。
Semiconductor vehicle-mounted cold and warm box with efficient heat exchange structure
一种具有高效热交换结构的半导体车载冷暖箱
2025-01-07
Patent
Electronic Resource
Chinese
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