The invention discloses a plate placing vehicle. The plate placing vehicle comprises a supporting assembly, a bracket and a transmission mechanism. The supporting assembly comprises a supporting plate, a mounting bracket and moving wheels, and the mounting bracket is mounted on the top wall of the supporting plate; a containing groove is defined by the bracket, an opening is formed in the upper end wall of the bracket in the containing groove, and a supporting flange is arranged in the containing groove. The transmission mechanism is installed on the installation support and comprises a guiding assembly and a driving assembly, the bracket is connected and matched with the guiding assembly, the guiding assembly is in transmission connection with the driving assembly, and the driving assembly drives the guiding assembly to drive the bracket to move. Therefore, the waste frame of the board is in lap joint with the supporting flange of the bracket, and the supporting flange supports the board by supporting the waste frame, so that compared with the prior art, when the board is a circuit board, the circuit layout and surface paint of the circuit board are not in contact with the board placing vehicle when the board placing vehicle is used for storing the circuit board; and the surface of the circuit board is not easy to scratch and damage, so that the yield of the circuit board can be improved.
本申请公开了一种板料放置车,板料放置车包括支撑组件、托架和传动机构。支撑组件包括支撑板、安装支架和移动轮,安装支架安装于支撑板的顶壁;托架限定出容纳槽,容纳槽在托架的上端壁形成有敞开口,容纳槽内具有支撑挡边;传动机构安装于安装支架,传动机构包括导向组件和驱动组件,托架与导向组件连接配合,导向组件与驱动组件传动连接,驱动组件驱动导向组件带动托架运动。由此,通过使板料的废料边框与托架的支撑挡边搭接,支撑挡边通过支撑废料边框以支撑板料,与现有技术相比,当板料为电路板时,利用板料放置车收纳电路板时电路板的电路布局和表面油漆不与板料放置车接触,电路板表面不易产生刮擦损伤,从而可以提高电路板的良品率。
Plate placing vehicle
板料放置车
2024-03-05
Patent
Electronic Resource
Chinese
IPC: | B62B Von Hand bewegte Fahrzeuge, z.B. Handkarren oder Kinderwagen , HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS |
Tissue placing device, vehicle assembly with tissue placing device and vehicle
European Patent Office | 2020
|Plate placing vehicle for electroplating production of printed circuit board
European Patent Office | 2021
|