The invention provides a structure-integrated grounding device for satellites, which comprises a grounding pile embedded part, two end surfaces of the grounding pile embedded part are flush with two end surfaces of a structural plate, the grounding pile embedded part and the structural plate are co-cured, and the grounding pile embedded part can be used as a standard part to be integrally formed with the structural plate; the grounding pile embedded part can be manufactured into standard parts of different specifications according to the thickness size of a satellite structural plate, satellite single-machine grounding connection can be achieved on the two faces of the grounding pile embedded part, and the grounding embedded part and the structural plate are in electric lap joint through conductive adhesive. The mode that a conventional grounding pile is installed on a structural plate is abandoned, the grounding device is light in weight and reliable in connection, does not occupy satellite space, can be connected with grounding wires on two faces, facilitates satellite structure layout design, avoids the interference problem frequently occurring in the aspects of satellite layout, three-dimensional wiring and the like, reduces wiring between the grounding piles, and improves the reliability of the grounding device. Meanwhile, through a structural plate co-curing mode, the structural plate and other embedded parts are jointly achieved in the structural plate machining process, and the design method of the standard part is beneficial to structural design.

    本发明提供了一种卫星用结构一体化接地装置,包括接地桩埋件,接地桩埋件两端面与结构板两端面保持平齐,采取与结构板共固化方式,接地桩埋件可作为标准件与结构板一体化成型;接地桩埋件可根据卫星结构板厚度尺寸制作不同规格的标准件,接地桩埋件两面均可实现卫星单机接地连接,接地埋件与结构板通过导电胶实现电搭接。本发明摒除了常规接地桩安装在结构板上的方式,且该接地装置重量轻,连接可靠,不占用卫星空间,可两面连接接地线,有利于卫星结构布局设计,避免了卫星布局、三维布线等方面经常发生的干涉问题,减少了接地桩之间的走线,同时通过结构板共固化方式,在结构板加工过程中与其他埋件共同实现,标准件的设计方法有利于结构设计。


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    Title :

    Structure-integrated grounding device for satellite


    Additional title:

    卫星用结构一体化接地装置


    Contributors:
    ZHANG PENGSONG (author) / XUE JINGSAI (author) / XIA JUN (author) / JIANG YAZHOU (author) / ZENG QI (author) / SHEN JUNFENG (author) / YUAN RONGGANG (author)

    Publication date :

    2024-02-27


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS / B64G Raumfahrt , COSMONAUTICS



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