The invention discloses an infrared radiation absorption and stealth structure based on a plasmon hot carrier effect. The infrared radiation absorption and stealth structure comprises a resistor and a radiation absorption module arranged at a radiation emission part, the radiation absorption module comprises a metal nanoparticle array and a semiconductor device; the metal nanoparticle array is used for absorbing infrared radiation generated by the radiation emission part and generating hot electrons and holes; the semiconductor device is provided with a PN junction; hot electrons and holes generated by the metal nanoparticle array are respectively transmitted to two ends of a PN junction of the semiconductor device. The two ends of the PN junction of the semiconductor device are connected through a first connecting wire, and the first connecting wire is electrically connected with the resistor. The invention further provides an infrared radiation absorption and stealth device based on the plasmon hot carrier effect, the absorption effect of infrared radiation is greatly improved through the local surface plasma resonance effect, meanwhile, energy can be transferred, and then the stealth effect of a target is improved.

    本发明公开了一种基于等离激元热载流子效应的红外辐射吸收与隐身结构,包括:电阻和设置在辐射发射部位处的辐射吸收模块;辐射吸收模块包括金属纳米颗粒阵列和半导体器件;金属纳米颗粒阵列用于吸收辐射发射部位产生的红外辐射并产生热电子和空穴;半导体器件具有PN结;金属纳米颗粒阵列产生的热电子和空穴分别传输至半导体器件的PN结的两端;半导体器件的PN结的两端通过第一连接导线连接且第一连接导线与电阻电连接。本发明还提供一种基于等离激元热载流子效应的红外辐射吸收与隐身装置,本发明通过局域表面等离子体共振效应极大地提高了红外辐射的吸收效果,同时能够将能量转移,进而提升了目标的隐身效果。


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    Title :

    Infrared radiation absorption and stealth structure and device based on plasmon hot carrier effect


    Additional title:

    一种基于等离激元热载流子效应的红外辐射吸收与隐身结构和装置


    Contributors:
    MA XIANGCHAO (author) / FAN HAOJIANG (author) / MENG GANG (author) / JIANG JIALI (author) / LIU JIAQI (author) / LIU XIN (author) / XUE LIAN (author) / CAI WENLIN (author) / ZHU ZIHUI (author) / LU WEI (author)

    Publication date :

    2023-09-26


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / F41H Panzerung , ARMOUR / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT



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