A virtual variable pit plasma turbulence friction resistance reduction device comprises a pit flat plate (1) and a virtual pit plasma exciter (2). The pits on the pit flat plate (1) are arranged in a staggered mode or in a matrix mode. The virtual pit plasma exciter (2) is arranged on the pit flat plate (1), is a dielectric barrier discharge plasma exciter and comprises a high-voltage electrode (21), a dielectric layer (22) and a low-voltage electrode (23). The invention further provides a virtual variable pit plasma turbulence friction resistance reduction method and a flexible plasma exciter rapid preparation method based on mask spraying. According to the invention, a plasma excitation active flow control technology and a pit passive flow control technology are combined, and a virtual pit-shaped surface formed by plasma excitation is utilized, so that the disturbance intensity of a pit to a flow field is improved, and the resistance reduction effect is enhanced. In addition, the intensity of the variable pit plasma pneumatic excitation device can be adjusted according to incoming flow conditions, and the method can be easily combined with a sensor to form a closed-loop self-adaptive turbulence friction resistance reduction device.

    一种虚拟可变凹坑等离子体湍流摩擦减阻装置,包括凹坑平板(1)和虚拟凹坑等离子体激励器(2)。凹坑平板(1)上的凹坑为交错排列或矩阵型排列。虚拟凹坑等离子激励器(2)布置于凹坑平板(1)上,为介质阻挡放电等离子体激励器,包括高压电极(21)、介质层(22)和低压电极(23)。还提供一种一种虚拟可变凹坑等离子体湍流摩擦减阻方法,以及一种基于掩膜喷涂的柔性等离子体激励器快速制备方法。本发明将等离子体激励主动流动控制技术与凹坑被动流动控制技术相结合,利用等离子体激励所形成的虚拟凹坑形面,提高凹坑对流场的扰动强度,增强减阻效果。此外,可变凹坑等离子体气动激励装置的强度可根据来流条件调节,本发明方法易于与传感器结合,形成闭环自适应的湍流摩擦减阻装置。


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    Title :

    Virtual variable pit plasma turbulence friction resistance reduction device and preparation method


    Additional title:

    一种虚拟可变凹坑等离子体湍流摩擦减阻装置及制备方法


    Contributors:
    ZONG HAOHUA (author) / FANG ZIQI (author) / WU YUN (author) / SU ZHI (author) / LIANG HUA (author)

    Publication date :

    2023-07-18


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    B64C AEROPLANES , Flugzeuge / B23K Löten , SOLDERING OR UNSOLDERING / G06F ELECTRIC DIGITAL DATA PROCESSING , Elektrische digitale Datenverarbeitung / H05H Plasmatechnik , PLASMA TECHNIQUE



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