The invention relates to a sensor framework assembly which comprises a framework body (1), a chip part (2) and an insertion piece (3), the chip part (2) and the insertion piece (3) are fixedly connected with each other, and the framework body (1) is formed by an injection molding body which at least partially wraps the chip part (2) and the insertion piece (3). The invention further relates to a manufacturing method of the sensor framework assembly and a wheel speed sensor comprising the sensor framework assembly. The framework body is formed through injection molding in the state that the chip part and the insertion piece are fixedly connected with each other, the situation that the chip is not installed in place or is not firmly matched on the framework body is avoided, and the position consistency of the chip can be ensured.

    本发明涉及一种传感器骨架总成,该传感器骨架总成包括骨架本体(1)、芯片部(2)和插片(3),其中,所述芯片部(2)和所述插片(3)彼此固定连接,所述骨架本体(1)由至少部分地包裹所述芯片部(2)和所述插片(3)的注塑体形成。本发明还涉及该传感器骨架总成的制造方法和包括该传感器骨架总成的轮速传感器。通过在芯片部和插片彼此固定连接的状态下注塑形成骨架本体,避免了芯片在骨架本体上安装不到位或配合不牢固的情况,能够确保芯片位置一致性。


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    Title :

    Sensor framework assembly, manufacturing method thereof and wheel speed sensor


    Additional title:

    传感器骨架总成及其制造方法和轮速传感器


    Contributors:
    SUN YUN'AN (author) / LIU JINLONG (author)

    Publication date :

    2023-04-04


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    G01P MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK , Messen der Linear- oder Winkelgeschwindigkeit, der Beschleunigung, der Verzögerung oder des Stoßes / B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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