Metal coated polymer packaged power semiconductor modules, methods of making/using such power modules, and vehicles having traction power inverters containing such power modules are provided. A power electronic assembly includes one or more power semiconductor modules enclosed within an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymer encapsulant encapsulating the substrate and the semiconductor device therein, and an electrical lead connected to the semiconductor device and protruding from the polymer encapsulant. A metal or ceramic coating is applied to selected portions of the exposed outer surface of the polymer encapsulant. The metal/ceramic coating may be a single metal layer covering almost all exposed surface areas of the outer surface of the polymeric encapsulant. Optional hydrophobic polymer layers, passivation layers, and/or oxide layers may cover the outer surface of the metal layer. Alternatively, another metal layer or embedded layered microstructure may cover the metal layer.
提供了金属涂覆的聚合物封装的功率半导体模块、制造/使用此类功率模块的方法、以及具有含有此类功率模块的牵引功率逆变器的车辆。功率电子组装件包括一个或多个包封在组装件壳体内部的功率半导体模块。每个功率模块包括基板、安装在该基板上的半导体器件、在其中包入该基板与半导体器件的聚合物封装剂、和连接到该半导体器件上并从该聚合物封装剂中突出的电引线。将金属或陶瓷涂层施加到聚合物封装剂的暴露外表面的所选部分上。该金属/陶瓷涂层可以是覆盖聚合物封装剂外表面的几乎所有暴露表面区域的单一金属层。任选的疏水性聚合物层、钝化层和/或氧化层可覆盖该金属层的外表面。或者,另一金属层或嵌入层状微结构可覆盖该金属层。
METAL COATED POLYMER ENCAPSULATED ELECTRONIC MODULE AND
金属涂覆的聚合物封装的电子模块及其制造方法
2022-10-18
Patent
Electronic Resource
Chinese
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