The invention discloses a jointed board structure for a ship, a ship body deck assembly, a ship body and a manufacturing method, and the jointed board structure comprises at least one first aggregate, and each first aggregate is provided with a first panel; the at least two main plates are sequentially arranged in a tiled mode, and the end portions of every two adjacent main plates are connected through welding; a welding seam of every two adjacent main plates is arranged on the upper surface of the corresponding panel, and each welding seam is provided with the corresponding panel. According to the invention, the profile steel with the panel is adopted at the welding seam of the main plate, the welding seam of the main plate is supported by the first aggregate, the internal plate seam is arranged at the position of the aggregate, at the moment, the first aggregate can perform structural reinforcement on the internal plate seam, and deformation at the plate seam can be greatly reduced by means of the first aggregate during later-stage hot work correction; and meanwhile, the first aggregate can also be used as a constraint of the main board.

    本发明公开了一种船用拼板结构、船体甲板组件、船体及制造方法,包括:至少一个第一骨材,每个所述第一骨材均具有第一面板;至少两个主板,所述至少两个主板依次平铺设置,且相邻两个所述主板的端部通过焊接相连接;相邻两个所述主板的焊缝设于所述面板的上表面,且每个所述焊缝均具有对应的所述面板。在本发明中,在主板的焊缝处采用带面板的型钢,主板的焊缝得到第一骨材的支撑,内部板缝设置在骨材的位置,此时第一骨材能够对内部板缝进行结构加强,在后期进行火工矫正时,借助第一骨材,板缝处变形会极大减少,同时第一骨材也可作为主板的约束。


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    Title :

    Marine jointed board structure, hull deck assembly, hull and manufacturing method


    Additional title:

    船用拼板结构、船体甲板组件、船体及制造方法


    Contributors:
    LI NING (author) / NA TIESUO (author) / LIAN ZHAOHUA (author) / YE FEI (author) / ZHAI JIAWEI (author) / MENG JINZHOU (author) / WANG JIE (author)

    Publication date :

    2022-10-11


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    B63B Schiffe oder sonstige Wasserfahrzeuge , SHIPS OR OTHER WATERBORNE VESSELS / B23K Löten , SOLDERING OR UNSOLDERING



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