The invention relates to the technical field of auxiliary structures of vehicle-mounted electronic equipment, in particular to an anti-condensation structure of vehicle-mounted electronic equipment. The anti-condensation structure comprises a shell for mounting a PCB (Printed Circuit Board), and the inner side face and/or the outer side face of the shell are/is covered with a heat conduction layer. The invention aims to provide the anti-condensation structure of the vehicle-mounted electronic equipment. By adopting the technical scheme provided by the invention, the technical problem that a condensation phenomenon easily occurs outside the electronic equipment in a current active heat dissipation technology is solved.

    本发明涉及车载电子设备辅助结构技术领域,尤其涉及一种车载电子设备防凝露结构,包括用于装设PCB板的壳体;在所述壳体的内侧面和/或外侧面覆盖有导热层。本发明的发明目的在于提供一种车载电子设备防凝露结构,采用本发明提供的技术方案解决了目前主动散热技术容易在电子设备外发生凝露现象的技术问题。


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    Title :

    Anti-condensation structure of vehicle-mounted electronic equipment


    Additional title:

    一种车载电子设备防凝露结构


    Contributors:
    LIU ZHONGWEI (author) / CHEN JIANXIN (author) / XING XIUPENG (author)

    Publication date :

    2022-02-11


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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