The invention relates to a a wave-soldering carrier returning device comprising a carrier frame and an AGV, the carrier frame comprises an upper-layer carrier frame and a lower-layer base frame, the upper-layer carrier frame is used for bearing products, a traction mechanism is arranged on the AGV, and a hanging mechanism is arranged on the lower-layer base frame. The traction mechanism can be matched with the hanging mechanism so that the AGV can be in butt joint with the carrier frame. After butt joint, the AGV can drive the carrier frame to move together in the operation process. Accordingto the wave-soldering carrier returning device, the carrier frame is divided into the upper layer and the lower layer, the AGV and the lower layer base frame of the carrier frame are in butt joint, wave soldering furnace passing carriers, namely the upper layer carrier frame, can be rapidly and accurately recycled and conveyed automatically, and recycling of the furnace passing carriers is achieved.

    一种波峰焊载具回传装置,包括载具架,所述波峰焊载具回传装置还包括AGV,所述载具架包括上层载架和下层基架,所述上层载架用以承载产品,所述AGV上设有牵引机构,所述下层基架上设有挂靠机构,所述牵引机构能够与所述挂靠机构配合以使所述AGV和所述载具架对接;对接后,所述AGV在运转过程中能够带动所述载具架一起运动。本发明的所述波峰焊载具回传装置通过将所述载具架设置为上下两层,利用所述AGV和所述载具架的下层基架的对接,能够快速准确地对波峰焊过炉载具,即所述上层载架,进行自动回收和输送,实现过炉载具的循环使用。


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    Title :

    Wave-soldering carrier returning device


    Additional title:

    波峰焊载具回传装置


    Contributors:
    AI SHUYI (author) / HUANG JINHUA (author) / PAN NAIYING (author)

    Publication date :

    2021-03-30


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Chinese


    Classification :

    IPC:    B62D MOTOR VEHICLES , Motorfahrzeuge / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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