An electromagnetic interference (EMI) grounding protection method for a connector assembly using a multi-directional conductive housing. The method includes the steps of: conducting the EMI generatedby a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the multi-directional conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the multi-directional conductive housing, the multi-directional conductive housing being mounted onto a metallic device by at least a metallic bolt andthe bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the metallic braided shield to the multi-directional conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the metallic braided shield to the multi-directional conductive housingdirectly through conductive pads thereof, and ultimately to the metallic device.
一种用于使用多向导电壳体的连接器组件的电磁干扰(EMI)接地保护方法。该方法包括以下步骤:将由源产生的EMI朝金属编织屏蔽件传导,所述金属编织屏蔽件通过金属夹具固定并安装到多向导电壳体上;将EMI从金属编织屏蔽件传导至金属夹具并传导至所述多向导电壳体,所述多向导电壳体至少通过金属螺栓安装到金属装置,并且该螺栓被容纳在对应的金属压缩限制器内;以及之后,将EMI(1)从所述金属编织屏蔽件传导至所述多向导电壳体,传导通过所述金属压缩限制器并通过其相应的螺栓,并最终传导至所述金属装置;并且(2)从所述金属编织屏蔽件传导至所述多向导电壳体,直接传导通过所述多向导电壳体的导电垫,并最终传导至所述金属装置。
AN ELECTROMAGNETIC INTERFERENCE (EMI) GROUNDING PROTECTION METHOD FOR A CONNECTOR USING A MULTI-DIRECTIONAL CONDUCTIVE HOUSING
用于使用多向导电壳体的连接器的电磁干扰(EMI)接地保护方法
2021-03-19
Patent
Electronic Resource
Chinese
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