An integrated circuit material transferring device is used for transferring working pieces to a second carrying device from a first carrying device, and comprises a frame, a push rod carrier, push rods and a material push block. The frame comprises a baffle and a side plate. The push rod carrier is fixed to the frame and arranged in the mode of being opposite to the baffle. The encircling region of the baffle, the side plate and the push rod carrier is a material transferring region where the first carrying device and the second carrying device are placed. The push rods pass through passing holes formed in the push rod carrier and extend towards the baffle in the first direction. The material push block is fixedly connected with the ends, close to the baffle, of the push rods.
一种集成电路倒料装置,用于将工作件自第一承载装置转移至第二承载装置,其包括:框架、推杆载体、推杆以及推料块。所述框架包括挡板与侧板。所述推杆载体固定于所述框架上并与所述挡板相对设置。所述挡板、所述侧板与所述推杆载体的包围区域为放置所述第一承载装置和所述第二承载装置的倒料区域。所述推杆穿过所述推杆载体上的穿孔,并朝所述挡板沿第一方向延伸。所述推料块固定连接所述推杆靠近所述挡板的一端。
Integrated circuit material transferring device
集成电路倒料装置
2020-08-18
Patent
Electronic Resource
Chinese
IPC: | B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last |