According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.

    Selon un mode de réalisation de l'invention, un système de gestion thermique qui comprend au moins un cadre de châssis configuré pour minimiser la résistance à l'étalement thermique d'un système de gestion thermique. Le cadre de châssis comprend au moins un corps de châssis, au moins une ossature thermique intégrée dans le corps de châssis et un fluide de travail dans l'ossature thermique pour dissiper la chaleur du corps de châssis.


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    Title :

    THERMAL MANAGEMENT SYSTEMS AND METHODS FOR HEAT GENERATING ELECTRONICS


    Additional title:

    SYSTEMES DE GESTION THERMIQUE ET METHODE DESTINES A DES DISPOSITIFS ELECTRONIQUES PRODUISANT DE LA CHALEUR


    Contributors:

    Publication date :

    2019-12-31


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B33Y ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING , Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT



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