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    Title :

    Thermal fatigue analysis of PBGA packages in automotive environment


    Additional title:

    Untersuchung der thermischen Ermuedung von PBGA Packages in der Fahrzeugumgebung.



    Publication date :

    1998


    Size :

    15 pages


    Remarks:

    SAE-Paper;980350;1998;Electronic Packaging;SAE Spec.Publ.; SP-1345


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



    Thermal Fatigue Analysis of PBGA Packages in Automotive Environment

    Song, X. / Pao, Y.-H. | SAE Technical Papers | 1998


    Thermal Fatigue Analysis of PBGA Packages in Automotive Environment

    Pao, Y.-H. / Song, X. / Society of Automotive Engineers | British Library Conference Proceedings | 1998


    PBGA reliability study for automotive applications

    Adams,R.M. / Glovatsky,A. / Lindley,T. et al. | Automotive engineering | 1998


    PBGA Reliability Study for Automotive Applications

    Adams, R. M. / Glovatsky, A. / Lindley, T. et al. | British Library Conference Proceedings | 1998


    PBGA Reliability Study for Automotive Applications

    Glovatsky, Andrew / Mawer, Andrew / Evans, John L. et al. | SAE Technical Papers | 1998