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    Title :

    Resolving sub-chip spaced multipath components in CDMA communication systems


    Additional title:

    Aufloesung von Mehrwegkomponenten mit Sub-Chip Abstand in CDMA Kommunikationssystemen.


    Contributors:

    Publication date :

    1993


    Size :

    4 pages


    Remarks:

    43rd IEEE Vehicular Technology Conference (Secaucus); 1993;Inst.of Electrical and Electronics Eng.


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



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