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    Title :

    Je komplexer, desto kosteneffizienter - Molded Interconnect Device ( MID )


    Additional title:

    Molded Interconnect Device ( MID ).


    Contributors:
    Stumpp,B. (author)

    Published in:

    Publication date :

    2010


    Size :

    2 pages


    Remarks:

    Automobil-Produktion;23(2010)9 ;78-79


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    German