Modeling Thermal Residual Stresses in Composite Patch Repairs During Multitemperature Bonding Cycles
J. Cho, C. T. Sun
Journal of Aircraft ; 40 , 6 ; 1200-1205
2003
Article (Journal)
Electronic Resource
English
Modeling Thermal Residual Stresses in Composite Patch Repairs During Multitemperature Bonding Cycles
Online Contents | 2003
|Multi-Step Bonding Cycles for Lowering Thermal Residual Stresses in Composite Patch Repairs
British Library Conference Proceedings | 2002
|