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    Title :

    Temperature Distribution Pattern in PILC Cable with Void Defect by Using COMSOL Multiphysics


    Contributors:

    Conference:

    International Conference on Robotics, Vision, Signal Processing and Power Applications ; 10. ; 2018 ; George Town, Pinang



    Publication date :

    2019



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English



    Classification :

    DDC:    629.8/92



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