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    Title :

    Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors


    Contributors:
    Waber, T. (author) / Pahl, W. (author) / Schmidt, M. (author) / Feiertag, G. (author) / Stufler, S. (author) / Dudek, R. (author) / Leidl, A. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 20 , 4/5 ; 861-867


    Publication date :

    2014-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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