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    Title :

    Numerical analysis of heat transfer in a manifold microchannel heat sink with high efficient copper heat spreader


    Contributors:
    Wang, Y. (author) / Ding, G. F. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 14 , 3 ; 389-395


    Publication date :

    2008-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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