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    Title :

    Neuer Modul-Formfaktor: COM Express geschrumpft


    Published in:

    ELEKTRONIK -MUNICH- ; 56 , 20 ; 81-81


    Publication date :

    2007-01-01


    Size :

    1 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    German


    Classification :

    DDC:    621.3



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