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    Title :

    High-temperature instrumented microscale compression molding of Pb


    Contributors:
    Cao, D. M. (author) / Meng, W. J. (author) / Kelly, K. W. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 10 , 4 ; 323-328


    Publication date :

    2004-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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