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    Title :

    Thermal stresses in box-type laser packages


    Contributors:
    CHENG, W. H. (author) / YANG, Y. D. (author) / LIANG, T. C. (author) / WANG, G. L. (author) / SHEEN, M. T. (author) / KUANG, J. H. (author)

    Published in:

    Publication date :

    1999-01-01


    Size :

    10 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    537.5



    Effects of Au coating on thermal stresses in stainless-to-Kovar packages

    Cheng, W. H. / Wang, W. H. / Yang, Y. D. et al. | British Library Online Contents | 1997


    Laser Induced Thermal Stresses in Composite Materials

    Couick, J. R. / AIAA | British Library Conference Proceedings | 1996


    A Notch-Saddle-Compensation Technique in Butterfly-Type Laser Module Packages

    Hsu, Y.-C. / Tsai, Y.-C. / Kuang, J.-H. et al. | British Library Online Contents | 2007


    Transient thermal analysis for electronic packages

    CHACKO, M. J. / MANI, LEELAMMA / SHUKLA, K. N. | AIAA | 1987


    Alleviation of thermal stresses

    Parkes, E.W. | Engineering Index Backfile | 1953