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    Title :

    New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Modulation Characteristics


    Contributors:
    Hayashi, T. (author) / Katsura, K. (author) / Tsunetsugu, H. (author)

    Published in:

    Publication date :

    1994-01-01


    Size :

    1963 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    621.3692



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