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    Title :

    Electrothermal Simulation of IGBT Module Based on Simulink


    Contributors:
    Guo, Mengxue (author) / Sha, Yanbei (author) / Wei, Lu (author) / Jiang, Xuedong (author)

    Conference:

    International conference on electrical engineering and information technologies for rail transportion



    Publication date :

    2022-01-01


    Size :

    9 pages



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English



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