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    Title :

    Power module packaging technologies for silicon and silicon carbide in automotive applications — challenges and solutions


    Contributors:

    Conference:

    Drivetrain for vehicles, EDrive, Transmissions in mobile machines (International VDI congress)



    Publication date :

    2018-01-01


    Size :

    12 pages



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    German



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