Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    An overview of Lead-Free Soldering for Brazilian Automotive Electronics Applications



    Conference:

    Congresso internacionais; 19th, Tecnologia da mobilidade; SAE Brasil congresso 2010 ; 2010 ; Sao Paulo, Brazil



    Publication date :

    2008-01-01


    Size :

    2010-36-0187


    Remarks:

    Papers 2010-36-0001 to 2010-36-0555 held with gaps



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





    Lead-free and no-clean soldering for automotive electronics

    Shangguan, D. / Gao, G. | Tema Archive | 1997


    Lead-free solder development for automotive electronics packaging applications

    Shangguan, Dongkai / Achari, A. | Tema Archive | 1995



    Lead Free Solder for Automotive Electronics

    Whitten, G. / Society of Automotive Engineers | British Library Conference Proceedings | 1998