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    Title :

    Microstructural Characterization and Properties of SiC/Al Composites for Electronic Packaging Fabricated by Pressureless Infiltration


    Contributors:

    Conference:

    International conference; 2nd, Magnesium ; 2006 ; Beijing


    Published in:

    Magnesium ; 1597-1602


    Publication date :

    2007-01-01


    Size :

    6 pages


    Remarks:

    Also known as ICM 2006. Held as part of 2006 Beijing International Materials Week (2006 BIMW)




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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