Microstructural Characterization and Properties of SiC/Al Composites for Electronic Packaging Fabricated by Pressureless Infiltration
International conference; 2nd, Magnesium ; 2006 ; Beijing
2007-01-01
6 pages
Also known as ICM 2006. Held as part of 2006 Beijing International Materials Week (2006 BIMW)
Conference paper
English
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