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    Title :

    2005-01-0556 Enhanced Imager Chip Packaging for Automotive Applications


    Contributors:
    Troxell, J. R. (author) / Burns, J. H. (author) / Chaudhuri, A. K. (author) / Pan, B. (author) / Nah, C. K. (author) / Teo, K. C. (author) / Ihms, D. (author) / Fox, S. (author) / Garner, T. (author) / Bauson, W. A. (author)

    Conference:

    Systems engineering, electronics simulation, advanced electronics packaging, and electromagnetic compatibility ; 2005 ; Detroit, MI



    Publication date :

    2005-01-01


    Size :

    10 pages


    Remarks:

    Held as a session of the SAE 2005 World Congress. Papers from a session of the SAE 2005 World Congress, Detroit, Mich. Includes bibliographic references.



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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