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    Title :

    IMECE2002-32874 Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging



    Conference:

    Session, Applied mechanics and biomedical technology ; 2002 ; New Orleans, LA



    Publication date :

    2002-01-01


    Size :

    10 pages


    Remarks:

    Held at the 2002 ASME international mechanical engineering congress and exposition



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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