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    Title :

    Three-dimensional through-wafer fan-out optical interconnects [3952-42]



    Conference:

    Conference; 2nd, Photonics packaging and integration ; 2000 ; San Jose, CA



    Publication date :

    2000-01-01


    Size :

    14 pages


    Remarks:

    Held in conjunction with the 7th conference on optoelectronic interconnects




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Three-dimensional through-wafer fan-out optical interconnects [3952-42]

    LeCompte, M. / Gao, X. / Bates, H. et al. | British Library Conference Proceedings | 2000


    Polymeric optoelectronic interconnects (Invited Paper) [3952-23]

    Eldada, L. A. / SPIE - The International Society for Optical Engineering | British Library Conference Proceedings | 2000


    Polymeric optoelectronic interconnects (Invited Paper) [3952-23]

    Eldada, L. A. / SPIE | British Library Conference Proceedings | 2000


    Microjet printing of micro-optical interconnects and sensors [3952-56]

    Cox, W. R. / Guan, C. / Hayes, D. J. et al. | British Library Conference Proceedings | 2000


    Microjet printing of micro-optical interconnects and sensors [3952-56]

    Cox, W. R. / Guan, C. / Hayes, D. J. et al. | British Library Conference Proceedings | 2000