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    Title :

    3D Structure Assembly Analysis with a Modular Approach suited to Parallel Computations


    Contributors:

    Conference:

    28th International symposium, Mechatronics - efficient computer support for engineering, manufacturing, testing & reliability ; 1995 ; Stuttgart; Germany



    Publication date :

    1995-01-01


    Size :

    8 pages


    Remarks:

    6; vols; Also known as 28th ISATA



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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