Optical and Package Design Issues for Chip-to-Chip Free-Space Optical Interconnections
Summer topical meeting, Hybrid optoelectronic integration and packaging ; 1993 ; Santa Barbara; CA
1993-01-01
2 pages
Shelved at "Leos 1993 Summer topical meeting digest on optical microwave interactions" IEEE cat no 93TH0549-6
Conference paper
English
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Alignment Considerations in the Package Design of Optical Interconnections
British Library Conference Proceedings | 1993
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